Graphene high thermal conductivity aluminum alloy

The graphene high thermal conductivity aluminum alloy material developed by the company has overcome the melting and casting problems of difficult infiltration of graphene and aluminum alloy, high temperature carbonization, and poor densification of composite materials.

The advanced production technology adopts processes such as online addition, degassing, stirring, filtering, and casting of aluminum alloy and graphene, ensuring that the material has excellent thermal conductivity and physical and chemical indicators. It provides a new material supply solution for aluminum alloy heat dissipation structural components needed in phased array radar field, large server heat sinks, electronic equipment casings, and heat dissipation in aerospace field.

The company's product types include:
6061 series aluminum alloy (thermal conductivity 210W/M.K ± 10)
6063 series aluminum alloy (thermal conductivity 300W/M.K+10)
6063 series aluminum alloy (thermal conductivity 300W/M.K+10)

Chemical composition

Ingredient	Percentage	Ingredient	Percentage
Aluminium（Al）	Excess (about 95% or more)	Copper（Cu）	0.15%-0.40%
Magnesium（Mg）	0.8%-1.2%	Manganese（Mn）、Chromium（Cr）	Trace (used to neutralize the harmful effects of iron and improve corrosion resistance)
Silicon（Si）	0.4%-0.8%	Other impurities	Single ≤ 0.05%, total ≤ 0.15%

Mechanical properties

Normal state

Tensile strength (ob): 205-310MPA (typical value 290 MPA)

Yield strength (o0.2): 110-276MPA (typical value 240 MPA)

Elongation (65): 12% -25% (>14% at room temperature)

Brinell hardness(HB):90-100

After optimizing the special process

The tensile strength can reach：2312 MPa

Yield strength：273 MPa

Elongation：12.8%

Physical properties

01

Coefficient of thermal expansion：23.6×10⁻⁶/℃

02

Thermal conductivity：200∽330W/(m·K)

03

Density：2.7 g/cm³

Application field

Radar structural components

Laptop shell

Large server chip heat sink

IGBT for new energy vehicles

PRODUCT