Graphene high thermal conductivity gasket is a new type of ultra-thin thermal gasket with ultra-low thermal resistance. This thermal pad mainly uses two-dimensional materials as thermal fillers, and utilizes advanced preparation techniques to arrange the two-dimensional materials in an orderly manner in a polymer matrix, forming a good thermal conductivity path and greatly improving the thermal conductivity efficiency. It is particularly suitable for high heat flux density equipment such as base stations and chips. In addition, the super Pu thermal conductive gasket has the characteristics of high resilience, low density, and is not easily deformed, and can be used as a substitute material for thermal conductive silicone grease.
Product performance
| NO. | Parameter | Test method | |||
|---|---|---|---|---|---|
| Color | Black | Visual inspection | |||
| Maximum standard size(MM) | 90*90 | ASTM D5947 | |||
| Thickness(MM) | 0.2~0.5(±10%) | ASTM D 374 | |||
| Density(G/CC) | s0.6 | ASTM D 792 | |||
| Compressive stress(PSI) | ≤65(@50%) | ASTM D575 | |||
| Tensile strength（Mpa） | Orientation | ≥0.05 | ASTM D412 | ||
| Vertical | ≥0.025 | ASTM D575 | |||
| Resilience(%) | 260 | ASTM D575 | |||
| Creep behavior(MM) | ≤1 | ASTM D 575 | |||
| Oil leakage rate(%) | ≤3 | CSMH | |||
| Operating temperature(℃) | -40~125 | IEC 60068-2-14 | |||
| Thermal properties | |||
|---|---|---|---|
| Thermal resistance(℃ ·cm²/W) | @20psi | ≤0.11 | ASTM D5470 |
| @40psi | ≤0.09 | ASTM D5470 | |
Application features
01
Soft surface and
good compressibility
02
Low density
03
Low thermal resistance
04
High resilience
05
Good thermal
stability
performance
Innovative thermal conductivity structure of graphene high thermal conductivity gasket
Thermal resistance test of graphene thermal conductive sheet
The thermal resistance gradually decreases with increasing pressure and then remains stable. It is recommended to use a pressure of ≥ 20psi
Application field
5G base station
AI chip
T/R component
Charging of new energy vehicles
