2025-09-17
Recently, China National Machinery Industry Corporation Limited released an investor relations activity record form. Guoji Precision Industry stated that diamond has excellent heat dissipation performance, but cost constraints limit its functional application. In the future, with the development of high-power devices and high-performance chips, heat dissipation issues will become increasingly prominent
2025-09-15
The requirements of "high power, high precision, and high reliability" for high-power phased array radar dictate that the temperature control system must simultaneously meet four major requirements: "precise temperature control, environmental adaptability, long-term stability, and controllable cost". Air conditioning and heating solutions, especially industrial-grade precision air conditioning, meet these requirements through their extremely high temperature control accuracy, full-scenario adaptability, high reliability, and controllable total lifecycle cost
2025-09-13
The logic of thermal stress deformation in RF components can be summarized as a clear causal chain:
Material CTE mismatch (root cause) → Temperature fluctuations (heating/environmental temperature changes, direct trigger) → Structural constraints (fixing/packaging, limiting expansion) → Stress accumulation unable to be released → Component warping, cracking, and other deformations.
2025-08-25
With the rapid development of technology and the ever-growing global demand for high-performance and high-efficiency semiconductor devices, semiconductor substrate materials, as a key technological link in the semiconductor industry chain, are becoming increasingly important. Semiconductor substrate materials serve as the foundation for manufacturing semiconductor devices and integrated circuits, and their performance directly affects the quality and performance of the final products. Traditional substrate materials have become difficult to meet the demands of these emerging fields.
2025-08-07
The graphite-aluminum-based composite solid-state temperature-equalizing plate is a new type of high-efficiency heat dissipation component.
It uses aluminum as the substrate, which provides structural support and basic thermal conductivity. At the same time, it is compounded with graphite core material. The layered structure of graphite is excellent, and it conducts heat particularly quickly within its own plane, leveraging this advantage.
