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2025-09-18

Jimi&Dangbei laser projector chip heat dissipation upgrade: can phase change paste and graphene gasket replace silicone grease?

The increasing heat consumption of smart projection products is the result of the combined effects of technological upgrades, functional expansions, and evolving user demands. On one hand, to meet users' pursuit of higher image quality, products continuously enhance light source power—shifting from traditional bulbs to LED and laser sources, and even adopting multi-source combined designs to optimize brightness and color.

2025-09-12

Carbon: Revealing the Graphitization Behavior of High Rigid and Thermal Conductive Graphite Carbon Fibers

The demand for lightweight and efficient thermal management materials is becoming increasingly urgent in fields such as new energy batteries, 5G communication, and aerospace thermal control. Traditional metal materials have excellent thermal conductivity but high density, while conventional polyacrylonitrile (PAN) - based carbon fibers are limited by structural defects and have insufficient thermal conductivity. For example, the commercial grade Cytec T-50 has a thermal conductivity of only about 70 W m ⁻¹ K ⁻¹, which is difficult to meet the heat dissipation needs of high-end equipment.

2025-09-09

Nobel Prize-level achievement! A major breakthrough has been made in the world-renowned challenge of high thermal conductivity composite materials, with multiple papers published in top journals, shoc

The research background of AI composite materials stems from the severe challenges that traditional composite material development paradigms are facing. The performance of composite materials is determined by countless interdependent variables, such as fiber orientation, layup sequence, process parameters, etc.

2025-09-05

An article analyzes how to choose the thickness of thermal pads, and how significant is the difference between 0.5mm and 1mm?

In the cooling system of electronic devices, thermal pads play a pivotal role. Take the CPU of a computer as an example. When it runs at high speed, it generates a large amount of heat. If this heat cannot be dissipated in time, it will lead to excessive CPU temperature, which in turn will affect the performance of the computer, causing stuttering or even a crash.

2025-09-03

How to choose thermal conductive silicone grease? Hard core analysis of seven core parameters

The demand for lightweight and efficient thermal management materials in fields such as new energy batteries, 5G communication, and aerospace thermal control is becoming increasingly urgent. Although traditional metal materials have excellent thermal conductivity, their density is too high, while conventional polyacrylonitrile (PAN) - based carbon fibers are limited by structural defects and have insufficient thermal conductivity. For example, the thermal conductivity of the commercial grade Cytec T-50 is only about 70%

2025-09-02

Encyclopedia: What is superhard abrasive

Superhard abrasives mainly refer to diamond and cubic boron nitride (CBN). Diamond is currently the hardest substance known in the world, and CBN's hardness is second only to diamond. These two types of superhard abrasives have much higher hardness than other materials, including grinding tool materials such as corundum and silicon carbide, as well as tool materials such as hard alloys and high-speed steel. When used as grinding wheel abrasives in the field of mechanical processing, they have the advantages of slow wear, high grinding ratio, low grinding force, and low heat generation. They play an irreplaceable role in advanced processing technologies such as high-speed and ultra high speed processing, precision and ultra precision processing, high-precision surface processing, intelligent and unmanned processing, etc.

2025-09-01

What exactly is thermal management? This article will turn you from a "thermal novice" into an "expert"

In simple terms, thermal management is the process of adjusting and controlling the temperature or temperature difference of a specific object through heating or cooling methods according to its requirements. It encompasses three key elements: the specific object, such as the mobile phone chip, computer CPU, battery, motor, etc. mentioned earlier; the implementation methods, like fans, heat sinks, liquid cooling systems, etc.; and the thermal management parameters, primarily temperature and temperature difference.

2025-08-30

Don't confuse anymore! 4-dimensional comparison of carbon fiber and graphene thermal pads, with clear reliability and attenuation at a glance

If the demand is for "medium power heat dissipation+low cost+high mechanical stability" (such as automotive electronics, industrial power supplies), carbon fiber thermal pads are a more practical choice with high reliability and controllable attenuation;

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